PLAZMARK O2 cleaning use / Ar cleaning use
Choose from three sensitivity levels! An evaluation tool for plasma treatment hardening, ideal for implementation processes and more.
The "PLAZMARK O2 Cleaning and Ar Cleaning" is an evaluation tool for the effectiveness of plasma treatment in the implementation and post-process stages. The "O2 Cleaning" is optimized for detecting radical plasma and can also be applied to UV cleaning and UV ozone cleaning. The "Ar Cleaning" efficiently detects ionic Ar plasma. In mixed systems with radical-based plasma or gases that serve as radical sources, the O2 Cleaning is more suitable. 【Usage Examples】 ■ Surface modification before plating ■ Surface modification of bonding surfaces such as wire bonding ■ Pre-cleaning before underfill after component mounting ■ Cleaning before sealing electronic devices such as LSI, memory, and MEMS *For more details, please refer to the catalog. Feel free to contact us with any inquiries.
- Company：サクラクレパス PI事業部
- Price：Other
